Midas Rework Systems by Turnpack

Industry-leading solutions for microelectronic rework and component removal

Precision Rework Solutions

Turnpack is the official manufacturer and global support provider for Midas Rework Systems, including the DeLidder and Hot Gas Rework Station. These systems are trusted by semiconductor, aerospace, and defense companies worldwide for precision component removal and rework.

Our systems are designed for applications where reliability and precision are critical, providing consistent results for failure analysis, component recovery, and board-level rework.

Midas Precision Rework Solution in action

Our Product Line

Midas DeLidder System

Industry Standard

Midas DeLidder System

The Midas DeLidder is a dry mechanical lid removal system designed for non-destructive rework of hermetic microelectronic packages.

Max Package Size

Up to 12" travel

Precision

±0.001" depth control

Process Type

Dry mechanical

Compatibility

Metal & ceramic packages

It features a precision spindle with closed-loop servo Z-axis control to mill off metal lids without damaging the ceramic base or internal die.

Ideal For:

Aerospace hybrids
Military components
Failure analysis
Hermetic packages
  • No heat, knives, or solvents — uses a high-speed rotary tool
  • Compatible with a wide range of package sizes and lid types
  • Depth control via encoder-based Z-positioning or mechanical shimming
  • Interchangeable fixtures for product-specific workholding
  • Models include D5L (standard), D5F (manual focus), and D5R (retrofit-ready)
Midas DeLidder System

Precision mechanical lid removal system for microelectronic packages

Hot Gas Rework System

Advanced Solution
Hot Gas Rework System

Localized thermal rework system for component removal

Hot Gas Rework System

The Midas Hot Gas Rework System delivers localized, high-temperature nitrogen gas for removing strongly attached components with minimal thermal spread and no mechanical stress.

Max Temperature

Up to 750°C

Gas Medium

Nitrogen (N₂)

Models

HGRS-V & HGRS-1J

Nozzle Sizes

.020"–.240"

Ideal For:

Flip chip removal
BGA rework
Stacked die access
Localized reflow
  • Hot gas delivery up to 750°C in seconds
  • Ultra-localized rework zone with minimal collateral heat
  • Available in HGRS-V and HGRS-1J models
  • Integrated shear tools for clean component removal

Service & Support

Turnpack provides comprehensive support for all Midas systems including spare parts, service contracts, process development, and training. Contact us for assistance or to request a quote.

Technical Support

Expert technical assistance for troubleshooting, maintenance, and system optimization.

Get Support

Spare Parts

Genuine Midas replacement parts and consumables to keep your systems running at peak performance.

Order Parts

Service Contracts

Preventative maintenance and priority service plans to maximize uptime and system longevity.

Learn More

Trusted by Leaders in Aerospace, Defense, and Microelectronics Packaging

Midas systems are used worldwide by top manufacturers and research labs for precision rework and recovery.

Raytheon Logo

Leading Aerospace OEM

L3Harris Logo

Tier 1 Defense Supplier

Qualcomm Logo

Semiconductor Manufacturer

Trusted Customer Logo

Research Institution

Ready to discuss your rework needs?

Contact our team to learn more about Midas Rework Systems and how they can improve your microelectronics processes.

Contact Us