Midas Hot Gas Rework Systems
Fast, precise thermal rework with localized nitrogen jets
Max Temperature
750°C
Process Gas
Nitrogen
Precision
±0.001"
Product Overview
The Midas HGRS Series is engineered to safely remove flip chips, stacked die, lids, and other microelectronic components using programmable jets of ultra-hot nitrogen. Built for high-value, high-reliability assemblies, these systems deliver fast thermal profiles with minimal heat spread — enabling clean, repeatable rework in aerospace, defense, telecom, and medical industries.
Key Benefits
High-Temperature Delivery
Hot gas delivery up to 750°C in seconds, providing rapid thermal profiles for efficient component removal.
Ultra-localized Rework
Precisely targeted heat zone with minimal collateral heat spread, protecting surrounding components and substrates.
Customizable Nozzles
Quartz nozzles in various shapes and sizes (.020–.240") for precise heat application to different component geometries.
Cooling Options
Optional nitrogen flood and spot cooling capabilities to protect sensitive areas and accelerate process cycles.
Integrated Shear Tools
Built-in shear mechanisms for clean component removal after reflow, minimizing damage and enabling precise handling.
Model Comparison
HGRS-V
Advanced Dual-Jet System
Key Specs:
- Dual independently controlled hot gas jets
- PID-controlled temperature and flow
- Preheated 4"x4" pin grid with vacuum air-bearing stage
- Timer-controlled process automation
- Shear force limiter and advanced die pickup options
- Includes microscope, LED illumination, and vacuum tools
Ideal For:
HGRS-1J
Compact Single-Jet System
Key Specs:
- Single hot gas jet on 45° arm
- Manual temperature control with PID
- Preheated 3"x3" spring-loaded workholder
- Manual X/Y stage and adjustable shear system
- Ideal for budget-conscious labs or light rework tasks
Ideal For:
Process Highlights
Load Part
Load part into preheated fixture with proper alignment and support.
Align Jet
Align jet and nozzle to target component for precise heat application.
Apply Heat
Engage hot gas profile to reflow bond with controlled temperature.
Remove Component
Remove component with integrated shear or vacuum pickup tool.
Cool Down
Use nitrogen flood to cool or protect surrounding areas as needed.
Technical Capabilities
System Specifications
| Feature | HGRS-V | HGRS-1J |
|---|---|---|
| Max Temp | 750°C+ | 700°C+ |
| Jets | 2 (independent) | 1 |
| Nozzle Sizes | .020–.240" (angled & straight) | .020–.240" (angled & straight) |
| Workholder | Vacuum-locked 4"x4" grid | 3"x3" spring-loaded grid |
| Shear Tool | Chain-driven, adjustable force | Manual screw with height lever |
| Vision System | Included w/ optics & lighting | Optional add-on |
| Cooling Features | N₂ Flood + Auto-purge | N₂ Flood |
What's Included
HGRS-V System
- Base system with dual hot gas jets
- Vacuum air-bearing stage with preheater
- Integrated microscope with LED illumination
- Starter set of nozzles (3 sizes)
- Shear tool with force limiter
- Vacuum pickup tools
- Comprehensive user manual and training
HGRS-1J System
- Base system with single hot gas jet
- Spring-loaded workholder with preheater
- Manual X/Y positioning stage
- Starter set of nozzles (2 sizes)
- Basic shear tool
- User manual and basic training
Optional Accessories
Additional Nozzle Sets
Custom sizes and shapes for specialized applications
Enhanced Vision System
Digital microscope with recording capabilities
Custom Workholders
Specialized fixtures for unique package geometries
Advanced Cooling System
Targeted cooling for sensitive components
Tooling & Options
Shear Tools
Wedge and straight-profile shear tools (0.02"–0.20") for various component sizes and applications.
Inquire
Custom Nozzles
Custom-shaped nozzles for directional heat targeting and specialized component geometries.
Inquire
Custom Workholders
Rotating or custom workholders for advanced rework scenarios and specialized board geometries.
InquireApplications
Die Removal
Precision removal and replacement of die components for repair or analysis.
Stacked Die Removal
Targeted removal of stacked die or lid components with minimal thermal impact.
Underfill Preheat
Controlled heating for underfill preheat or epoxy release applications.
Reflow Operations
Precision reflow or reballing preparation with controlled thermal profiles.
Failure Analysis
Prototyping and failure analysis applications requiring non-destructive component access.
Comprehensive Support
Turnpack provides full service and application support for all Midas HGRS systems. We offer installation, tooling customization, training, and replacement parts for both legacy and current models.
Ready to discuss your hot gas rework needs?
Contact our team to learn more about the Midas Hot Gas Rework Systems and how they can improve your microelectronics rework processes.
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